IBM Develops Smallest 32nm High-K Metal Gate Fabrication Process SRAM for Electronics Industry IBM公司開發最小的32納米高K金屬門製作工藝的SRAM為電子業

Nowadays the chipmakers are moving fast with the release of even smaller process technology to fabricate a processor, chipset or SRAM.如今,芯片製造商正在快速釋放,甚至更小的制程技術製造處理器,芯片組或SRAM 。 Not to be left behind, the famous giant chipmaker, IBM has just announced the readiness to develop new SRAM using 32 nanometer (HKMG) High-K Metal Gate process.不要被遺留下來的,著名的巨人英特爾, IBM公司剛剛宣布,準備開發新的SRAM使用32納米( hkmg )高k金屬柵的過程。 If you compare, Intel has just started to engage on 45 nanometer process technology for few of its new series of processors such as recently launched Intel Atom and upcoming Nehalem processor.如果您比較,英特爾才剛剛開始從事對45奈米制程技術為少數其新的系列處理器,例如最近推出的英特爾原子和即將舉行的nehalem處理器。 Whereas AMD is leaving far behind with its 65-nanometer processor, although more focus has been spent on re-architect its silicon design to recap some of the loss market.而AMD公司是離開,遠遠落後於它的65納米處理器,雖然越來越多的重點一直是用在重新建築師,其矽設計回顧一下一些損失的市場。

While processor architecture is important for a company success, leading edge fabrication technology is equally important in electronics world.而處理器架構是很重要的一間公司的成功,領先的製作技術是同樣重要的電子世界。 There are few advantages of smaller nanometer fabrication process.有幾個優勢,規模較小的納米製造工藝。 Firstly, the switching speed of the millions or even billions of transistors will be faster that boost up the processor overall performance.首先,開關速度的數百萬,甚至數十億的晶體管將更快地說,提高處理器的整體表現。 According to IBM, the migration will bring up the chip performance by 35 percent as compared to existing 45 nanometer parts.據IBM稱,移民帶來了芯片的性能由35 %相比,現有的45納米部分。 Besides, it allows a significant power savings of up to 50 percent, which is very crucial especially in today’s handheld market.此外,它允許用戶大大節省了功耗高達50 % ,這是非常重要的,尤其是在今天的手持設備市場。 Also, it will reduce the wafer cost eventually, although the initial migration cost seems to be higher.同時,將減少晶圓成本,最終,雖然最初的遷移成本似乎更高。

The new 32 nanometer fabricated prototypes will be ready by end of this year.新的32納米製造的原型,將準備就緒,今年年底。 It is believed that the new announcement will help to expand the popularity of 32 nanometer high-k technology through the foundries and partners with better momentum to start the whole die shrinking design by now.據認為,新的宣布,將有助於擴大普及, 32納米高K技術通過代工廠商和合作夥伴更好的勢頭開始萎縮,整個模具的設計,由現在。

IMPORTANT : You're reading a machine translated page which is provided "as is" without warranty. 重要說明:您正在閱讀的機器翻譯網頁是“按原樣”提供的擔保。 Unlike human translation, machine translation does not understand the grammar, semantics, syntax, idioms of natural language, thus often produce inaccurate and low quality text which is misleading and incomprehensible.不像人類翻譯,機器翻譯不明白的語法,語義,語法,成語自然語言,因此,往往產生不準確的和低品質的文字,是具誤導性的和難以理解的。 Thus, please refer to因此,請參閱 original English article英文原版的文章 when in doubt.有疑問時。



One Response to “IBM Develops Smallest 32nm High-K Metal Gate Fabrication Process SRAM for Electronics Industry” 1回應“ IBM公司開發最小的32納米高K金屬門製作工藝的SRAM為電子業”

  1. in3rtia
    April 18th, 2008 13:35 2008年4月18日13時35分
    1

    I was under the impression that IBM and AMD had a development alliance until 2011.我是下的印象是, IBM和AMD了發展聯盟,直到2011年。 AMD also has an Octo-Core (2x a native quad core, with dual core variants) 45nm Processor codenamed “Shanghai” that they are assuming will be released sometime in Q3ish 2008. AMD公司也有一octo核心( 2個土生土長四核心,雙核心變種) 45奈米處理器的代號為“上海”他們是假設將被釋放的某個q3ish 2008 。

    What we really have to worry about is the powerhouse of the Intel Nehalem, which seems to blow the Shanghai out of the water according to leaked tests by Sun.我們真的要擔心的是廠房英特爾nehalem ,這似乎打擊了上海出的水,根據洩漏測試,由Sun 。

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